h w d l protective overcoat resistive element copper t ermination solder plating nickel barrier layer alumina substrate copper w raparound t ermination 2 1 5 2 / 0 1 0 2 / 6 0 2 1 r l low v alue flat chip resistor lrc/lrf series ? standar d 2512, 2010 and 1206 sizes ? resistance values down to 0.003 ohms ? leach r esistant solder -plated copper wrap-ar ound termination ? low inductance - less than 0.2nh ? aec-q200 qualified general note w elwyn components r eserves the right to make changes in pr oduct specification without notice or liability . all information is subject to w elwyn? s own data and is consider ed accurate at time of going to print. ? w elwyn components limited bedlington, northumberland ne22 7aa, uk t elephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com w ebsite: www .welwyn-tt.com electrical data physical data 04.10 a subsidiary of tt electr onics plc w elwyn components 23 LR1206 lr2010 lr2512 * 0 . 2 / 5 . 1 0 . 1 5 . 0 s t t a w c 0 7 t a g n i t a r r e w o p r 1 o t 3 0 0 r 0 r 1 o t 3 0 0 r 0 r 1 o t 0 1 0 r 0 s m h o e g n a r e c n a t s i s e r 0 0 2 0 0 2 0 0 2 s t l o v e g a t l o v g n i d n a t s h t i w c i r t c e l e i d ) s m h o 0 5 0 . 0 w o l e b e u l a v r o f y r o t c a f t c a t n o c ( 0 0 1 c / m p p r c t % e c n a r e l o t e c n a t s i s e r r005 5%, >r005 1, 2, 5% 0 9 0 8 0 4 c r e w o p d e t a r t a e s i r e r u t a r e p m e t pad and trace ar ea for max power rating @ 70c mm 2 30 30 100 *2 w atts with total solder pad and trace size of 300 mm 2 dimensions (mm) d ) x a m ( h w l e z i s LR1206 0.480.25 0.480.25 0.480.25 lr2010 lr2512 i o` j i oc| bk?? == nol op l mq == n mwmt = ^j == m~ ? = n 3.200.305 1.630.20 0.8 0.84 0.84 5.230.38 2.640.25 6.500.38 3.250.25 LR1206 lr2010 lr2512 power rating @70c watts 0.5 1 2 resistance range 1 ohms r003 to 1r0 resistance tolerance 1 % LR1206 lr2010 lr2512 * 0 . 2 / 5 . 1 0 . 1 5 . 0 s t t a w c 0 7 t a g n i t a r r e w o p r 1 o t 3 0 0 r 0 r 1 o t 3 0 0 r 0 r 1 o t 0 1 0 r 0 s m h o e g n a r e c n a t s i s e r 0 0 2 0 0 2 0 0 2 s t l o v e g a t l o v g n i d n a t s h t i w c i r t c e l e i d ) s m h o 0 5 0 . 0 w o l e b e u l a v r o f y r o t c a f t c a t n o c ( 0 0 1 c / m p p r c t % e c n a r e l o t e c n a t s i s e r r005 5%, >r005 1, 2, 5% 0 9 0 8 0 4 c r e w o p d e t a r t a e s i r e r u t a r e p m e t pad and trace ar ea for max power rating @ 70c mm 2 30 30 100 *2 w atts with total solder pad and trace size of 300 mm 2 dimensions (mm) d ) x a m ( h w l e z i s LR1206 0.480.25 0.480.25 0.480.25 lr2010 lr2512 i o` j i oc| bk?? == nol op l mq == n mwmt = ^j == m~ ? = n 3.200.305 1.630.20 0.8 0.84 0.84 5.230.38 2.640.25 6.500.38 3.250.25 h w d l protective overcoat resistive element copper t ermination solder plating nickel barrier layer alumina substrate copper w raparound t ermination 2 1 5 2 / 0 1 0 2 / 6 0 2 1 r l low v alue flat chip resistor lrc/lrf series ? standar d 2512, 2010 and 1206 sizes ? resistance values down to 0.003 ohms ? leach r esistant solder -plated copper wrap-ar ound termination ? low inductance - less than 0.2nh ? aec-q200 qualified general note w elwyn components r eserves the right to make changes in pr oduct specification without notice or liability . all information is subject to w elwyn? s own data and is consider ed accurate at time of going to print. ? w elwyn components limited bedlington, northumberland ne22 7aa, uk t elephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com w ebsite: www .welwyn-tt.com electrical data physical data 04.10 a subsidiary of tt electr onics plc w elwyn components 23 LR1206 lr2010 lr2512 * 0 . 2 / 5 . 1 0 . 1 5 . 0 s t t a w c 0 7 t a g n i t a r r e w o p r 1 o t 3 0 0 r 0 r 1 o t 3 0 0 r 0 r 1 o t 0 1 0 r 0 s m h o e g n a r e c n a t s i s e r 0 0 2 0 0 2 0 0 2 s t l o v e g a t l o v g n i d n a t s h t i w c i r t c e l e i d ) s m h o 0 5 0 . 0 w o l e b e u l a v r o f y r o t c a f t c a t n o c ( 0 0 1 c / m p p r c t % e c n a r e l o t e c n a t s i s e r r005 5%, >r005 1, 2, 5% 0 9 0 8 0 4 c r e w o p d e t a r t a e s i r e r u t a r e p m e t pad and trace ar ea for max power rating @ 70c mm 2 30 30 100 *2 w atts with total solder pad and trace size of 300 mm 2 dimensions (mm) d ) x a m ( h w l e z i s LR1206 0.480.25 0.480.25 0.480.25 lr2010 lr2512 i o` j i oc| bk?? == nol op l mq == n mwmt = ^j == m~ ? = n 3.200.305 1.630.20 0.8 0.84 0.84 5.230.38 2.640.25 6.500.38 3.250.25 note 1: contact factory for value C tolerance combinations outside this range. note 2: many values = n x r001 and n x r005 up to n=10 are also available. note 3: recommended minimum pad & adjacent trace area for each termination for rated dissipation on fr4 pcb low v alue flat chip resistor lrc/lrf series ? w elwyn components limited bedlington, northumberland ne22 7aa, uk t elephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com w ebsite: www .welwyn-tt.com 04.10 w elwyn components recommended solder pad dimensions (mm) a b c LR1206 2.0 4.0 1.25 lr2010 3.05 6.5 1.5 lr2512 3.7 7.75 1.5 note: 1. although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on fr4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. full aec-q200 qualification applies to ohmic values r01. a c b i o` j i oc| bk?? == nol op l mq == n mwmt = ^j == m~ ? = o lrc 2512 1 w att lrc 2512 2 w att lrc 2010 0.5 watt lrc 2010 1 w att lrc 1206 0.25 w att lrc 1206 0.5 w att 25 70 150 (c) 0 20 40 60 80 100 (%) power rating ambient temperature or d e r in g p r o ced u r e ex a m p l e : lrf 2512 a t 1 0 mi lli o h m s (hence f lip -ch i p m o unt ed) and 2% t o l e rance o n a reel o f 1800 p i e ce s l r f 2 5 1 2 ? r 0 1 g w t yp e mount i n g c onve n t i ona l ( e l e m e n t up) v a l u e s > r 025 f f l i p - ch i p ( e l e m e n t dow n ) si ze va l ue (u s e i ec62 code) t o l e rance (u s e i ec62 code) f 1 % g 2 % j 5 % pa cki ng w t ape 1206 o r 2010 3000/ r eel s t anda r d 2512 1800/ r eel t 1 a l l s i z e s 1000/ r eel v a l u e s < r 025 aec-q200 t able 7 method max. (add r05) t yp. (@1r0) r ef t est 3 high t emp. exposur e mil-std-202 method 108 r% 0.5 0.2 4 t emperatur e cycling jesd22 method ja-104 r% 0.25 0.1 6 moistur e resistance mil-std-202 method 106 r% 0.5 0.2 7 biased humidity mil-std-202 method 103 r% 0.5 0.2 8 operational life (cyclic load) mil-std-202 method 108 r% 1 0.5 14 v ibration mil-std-202 method 204 r% 0.5 0.05 15 resistance to soldering heat mil-std-202 method 210 r% 0.25 0.05 16 thermal shock mil-std-202 method 107 r% 0.25 0.1 18 solderability j-std-002 >95% coverage 21 boar d flex aec-q200-005 r% 0.5 0.2 22 t erminal str ength aec-q200-006 r% 0.25 0.1 short t erm overload 6.25 x pr for 2s r% 0.5 low t emperatur e storage -65c for 100 hours r% 0.5 leach resistance solder dip at 250c 90s minimum
low value flat chip resistor lrc/lrf series www.bitechnologies.com www.irctt.com www.welwyn-tt.com general note tt electronics reserves the right to make changes in product specifcation without notice or liability. all information is subject to tt electronics own data and is considered accurate at time of going to print. ? tt electronics plc 2.14 low v alue flat chip resistor lrc/lrf series ? w elwyn components limited bedlington, northumberland ne22 7aa, uk t elephone: +44 (0) 1670 822181 facsimile: +44 (0) 1670 829465 email: info@welwyn-tt.com w ebsite: www .welwyn-tt.com 04.10 w elwyn components recommended solder pad dimensions (mm) a b c LR1206 2.0 4.0 1.25 lr2010 3.05 6.5 1.5 lr2512 3.7 7.75 1.5 note: 1. although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on fr4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. full aec-q200 qualification applies to ohmic values r01. a c b i o` j i oc| bk?? == nol op l mq == n mwmt = ^j == m~ ? = o lrc 2512 1 w att lrc 2512 2 w att lrc 2010 0.5 watt lrc 2010 1 w att lrc 1206 0.25 w att lrc 1206 0.5 w att 25 70 150 (c) 0 20 40 60 80 100 (%) power rating ambient temperature or d e r in g p r o ced u r e ex a m p l e : lrf 2512 a t 1 0 mi lli o h m s (hence f lip -ch i p m o unt ed) and 2% t o l e rance o n a reel o f 1800 p i e ce s l r f 2 5 1 2 ? r 0 1 g w t yp e mount i n g c onve n t i ona l ( e l e m e n t up) v a l u e s > r 025 f f l i p - ch i p ( e l e m e n t dow n ) si ze va l ue (u s e i ec62 code) t o l e rance (u s e i ec62 code) f 1 % g 2 % j 5 % pa cki ng w t ape 1206 o r 2010 3000/ r eel s t anda r d 2512 1800/ r eel t 1 a l l s i z e s 1000/ r eel v a l u e s < r 025 aec-q200 t able 7 method max. (add r05) t yp. (@1r0) r ef t est 3 high t emp. exposur e mil-std-202 method 108 r% 0.5 0.2 4 t emperatur e cycling jesd22 method ja-104 r% 0.25 0.1 6 moistur e resistance mil-std-202 method 106 r% 0.5 0.2 7 biased humidity mil-std-202 method 103 r% 0.5 0.2 8 operational life (cyclic load) mil-std-202 method 108 r% 1 0.5 14 v ibration mil-std-202 method 204 r% 0.5 0.05 15 resistance to soldering heat mil-std-202 method 210 r% 0.25 0.05 16 thermal shock mil-std-202 method 107 r% 0.25 0.1 18 solderability j-std-002 >95% coverage 21 boar d flex aec-q200-005 r% 0.5 0.2 22 t erminal str ength aec-q200-006 r% 0.25 0.1 short t erm overload 6.25 x pr for 2s r% 0.5 low t emperatur e storage -65c for 100 hours r% 0.5 leach resistance solder dip at 250c 90s minimum o r d e r ing pr o cedur e t h i s p ro d u c t h a s t w o v a lid p a rt num bers : e u r opean ( w e lw y n ) p a r t nu m b e r: l r f 1 2 0 6 - r0 2 f w ( 1206 , 20 m ill i o h m s 1 % , p b - f r ee) l r f 1 2 0 6 - r 0 2 f w 1 2 3 4 5 us a ( irc) p a r t nu m b e r : l rc - l r f 120 6 l f - 0 1 - r0 2 0 - f ( 1206, 2 0 m ill i o h m s 1 % , p b - f r e e ) l r c - l r f 1 2 0 6 l f - 0 1 - r 0 2 0 - f 1 2 3 4 5 6 7 ele c tr ical d ata l r 1 2 0 6 l r 2 0 1 0 l r 2 5 1 2 p o wer rat ng @ 7 0 c w a t s 0 . 5 1 2 re sist an c e range 1 o h m s r0 0 3 t o 1 r 0 re sist an c e t o l e ran c e 1 % < r0 1: 5 , r 0 1 : 1 , 2 , 5 t cr ppm / c r0 5: 1 0 0 , r 0 2 5 ? r 0 4 7 : < + 2 0 0 , r0 1 5 - r0 2 4 : < + 3 00, r0 1 - r 0 1 4 : < + 5 00, < r 0 1 : < + 9 0 0 d i e l e c t ri c w i t h st an d v o l t s 2 0 0 a m b i e n t t e m p e rat u r e ra n g e c - 55 t o + 1 5 0 v alu e s e2 4 p re f e rr e d 2 t e m p e rat u re ri se at ra ted p o we r c 4 0 8 0 9 0 p ad / t rac e ar e a 3 m m 2 3 0 1 0 0 3 0 0 n o t e 1: c o n t a c t f a c t ory f or v a l u e ? t o l era n ce c o m b i n a t o n s o u t s i d e t h i s r a n g e . n o t e 2: m a n y v al u e s = n x r 001 a nd n x r 005 up t o n = 10 are al s o a v ailab le. n o t e 3: r eco mme nde d m i n i m u m p a d & a d ja c e n t t r ace a r e a f or e ac h t e r m i n aton f or r at e d d i ssi p a t o n o n f r 4 p c b 1 2 3 4 5 t y p e si z e va lue tole r a n c e t e r m ina ti on & pa c k ing l r = c onv ent i ona l o r i ent a t i o n (v a l ues > r 025) 1206 e24 = 3 / 4 c hara c t e r s r = ohm s f = 1 % w pb - f ree, s t a ndard p a c k i n g 2010 g = 2 % t 1 pb - f ree, 1000 / re e l (n o n - s t anda rd ) l r f = f l i p - c h i p o ri e n t a t i on (v a l ues r 0 25) 2512 j = 5 % pb sn pb f i n i s h , s t and a rd p a c k i n g st andar d p a c k i ng i s t ape & re e l 1206 & 201 0 3000/ r eel 2512 1800/ r eel 1 2 3 4 5 6 7 f ami l y m ode l si z e t e r m ina ti o n t c r va lue tole r a n c e packing l r c l r = c onv ent i ona l o r i ent a t i o n (v a l ues > r 025) 1206 o m i t fo r s n pb 01 = s t a n dard ( 100pp m / c v a l ues r 0 5 ) 4 c h a ra c t e rs r = ohm s f = 1 % st andar d p a c k i ng i s t ape & r eel 2010 l f = pb - f r e e g = 2 % l r f = f l i p - c h i p o ri e n t a t i on (v a l ues r 0 25) 2512 j = 5 % 1206 & 201 0 3000/ r eel 2512 1800/ r eel
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